Littelfuse is one of America’s Best Mid-Sized Companies (Forbes) and has been named one of the Best Places to Work in Illinois (Best Companies Group) for 11 consecutive years. With its global headquarters in Chicago, Illinois, USA, Littelfuse is a leading, global manufacturer of electronic components serving more than 100,000 end customers across industrial, transportation, and electronics end markets. We have more than 17,000 employees with operations in 15 countries. From semiconductors to sensors… switches to fuses and more… we produce billions of electronic components that help our customers empower a sustainable, connected, and safer world. In 2021, Littelfuse had net sales of $2.1 billion.
In the position as R&D Manager(f/m/d) Power Discrete Packaging you will be reporting to the Director Discrete & IC Packaging R&D. In this position you will be responsible to drive the development of innovative, differentiated, and high-performance power discrete packaging. Additionally, you will lead a team of two direct reports located in Lampertheim.
About the position:
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Power Discrete packaging design including co-development with subcontract assembly and tooling suppliers using state-of-the-art CAD tools in support of new product development manufacturing transfer programs
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Periodic validation and review of design and project goals as part of the New Product Development Process
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Collaborate with our Supply Chain Team on vendor selection, qualification, and specification development
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Plan and execute test characterization, and qualification to optimize the assembly process and establish device manufacturing manufacturability and reliability
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Establish and maintain design rules for Power semiconductor discrete packaging
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Conduct and approve device packaging proposals, design, process flows, technical specifications, reliability requirements, data collection and analysis
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Document and maintain design documentation including device and component drawings, bonding diagrams etc. using Autodesk AutoCAD
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Interface closely with assembly sites both internal and external
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Effectively lead and develop a team – both in technical and business-minded skills to help establish a lean, strong, technically advanced yet business-aware group of power discrete package design R&D Professionals
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Protect IP through disclosures, patent applications, defensive publications and similar activities
About you:
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Bachelor’s or master’s degree in Engineering (Electrical, Mechanical or Microelectronic preferred)
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7+ years of experience in semiconductor packaging & assembly technology
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Very good written and oral communication skills in German and English
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Experience in leading and managing direct reports
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Proficiency in using ME 3D CAD tools for design, leadframe design and FEA for analysis. (Autodesk and ANSYS preferred)
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You’re open-minded, have an innovation mindset and are accustomed to work on tight deadlines and handling multiple priorities
Littelfuse strives to empower associate growth and development in a culture of ongoing collaboration and respect for diverse global perspectives and expertise. Our Core Values – Respect, Customer Focus, Agility, Collaboration – support us on our mission to improve the safety, reliability, efficiency, and performance of our customers’ products and systems.
We are an equal opportunity employer that takes pride in giving every associate the means and courage to make a difference – everywhere, every day.
We offer a competitive salary package and a variety of benefits, including work from home, flexible working hours as well as development opportunities like internal Lean Six Sigma Certification.
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